US 7,462,077 B2
Overmolded electronic assembly
Kin Yean Chow, Singapore (Singapore); Ching Meng Fang, Singapore (Singapore); Larry M. Mandel, Noblesville, Ind. (US); and Sim Ying Yong, Singapore (Singapore)
Assigned to Delphi Technologies, Inc., Troy, Mich. (US)
Filed on Nov. 27, 2006, as Appl. No. 11/604,575.
Prior Publication US 2008/0124987 A1, May 29, 2008
Int. Cl. H01R 12/24 (2006.01)
U.S. Cl. 439—736  [439/606] 7 Claims
OG exemplary drawing
 
1. An electrical component assembly comprising:
a substrate for supporting electrical components;
at least one electrical device carried on said substrate;
at least one interface component carried on said substrate in-circuit with said electrical device, said interface component having an outer perimeter surface and an elongate rib protruding outwardly from said outer perimeter surface, said elongate rib defining an inwardly facing abutment surface and an outwardly facing abutment surface spaced from said inwardly facing abutment surface; and
overmolding material partially encasing said interface component, said overmolding material defining an outwardly facing terminal edge adjacent said component perimeter surface abutting said inwardly facing abutment surface and exposing said outwardly facing abutment surface.