| US 7,459,118 B2 | ||
| Heated medium supplying method and structure for secondary molding of resin molded component | ||
| Hidehisa Nasu, Oobu (Japan); Akira Kuroyanagi, Chiryu (Japan); Masato Ichikawa, Kariya (Japan); and Akira Sahashi, Nagoya (Japan) | ||
| Assigned to Denso Corporation, Kariya (Japan) | ||
| Filed on Mar. 22, 2005, as Appl. No. 11/86,218. | ||
| Claims priority of application No. 2004-089198 (JP), filed on Mar. 25, 2004. | ||
| Prior Publication US 2005/0212176 A1, Sep. 29, 2005 | ||
| Int. Cl. B29C 45/73 (2006.01) | ||
| U.S. Cl. 264—328.16 [264/328.14; 425/547] | 10 Claims |
| 1. A heated medium supply method for secondary molding of a resin molded component, wherein a plurality of segmented primary
molded components are set in a secondary molding die and a heated medium is supplied to a flow path of a secondary molding
resin material, which flow path forms a join for coupling a plurality of the plurality of segmented primary molded components,
comprising:
an idling step to discharge the heated medium out of the die from a bypass before being supplied to the flow path;
a heated medium heating step to heat by supplying the heated medium to the flow path;
a resin material injection step to inject the secondary molding resin material into the flow path.
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