US 7,605,086 B2
	Corrosion resistant component of semiconductor processing equipment and method of manufacture thereof
Robert J. O'Donnell, Alameda, Calif. (US); Christopher C. Chang, Sunnyvale, Calif. (US); and John E. Daugherty, Alameda, Calif. (US)
Assigned to Lam Research Corporation, Fremont, Calif. (US)
Filed on Sep. 22, 2006, as Appl. No. 11/525,102.
Application 11/525102 is a division of application No. 09/749921, filed on Dec. 29, 2000, granted, now 7,128,804.
Prior Publication US 2007/0012657 A1, Jan. 18, 2007
Int. Cl. H01L 21/302 (2006.01)

U.S. Cl. 438—702  [438/762; 438/780; 438/787; 427/447]

13 Claims

1. A process of making a component of semiconductor processing equipment, the process comprising plasma spraying a liquid crystalline polymer on a surface of the component by feeding liquid crystalline polymer powder into a plasma flame to form molten or heat-softened particles, wherein the liquid crystalline polymer particles form a plasma sprayed coating on an outermost surface of the component.