US 7,604,920 B2
Positive resist composition, method of forming resist pattern, polymeric compound, and compound
Daiju Shiono, Kawasaki (Japan); Takahiro Dazai, Kawasaki (Japan); and Hiroaki Shimizu, Kawasaki (Japan)
Assigned to Tokyo Ohka Kogyo Co., Ltd., Kawasaki-shi (Japan)
Filed on Aug. 05, 2008, as Appl. No. 12/186,233.
Claims priority of application No. 2007-205500 (JP), filed on Aug. 07, 2007; and application No. 2008-003339 (JP), filed on Jan. 10, 2008.
Prior Publication US 2009/0042131 A1, Feb. 12, 2009
Int. Cl. G03F 7/004 (2006.01); G03F 7/30 (2006.01); C08F 10/00 (2006.01)
U.S. Cl. 430—270.1  [430/326; 430/905; 430/910; 526/280; 526/281; 526/284] 8 Claims
 
1. A positive resist composition comprising a base component (A) which exhibits increased solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure,
said base component (A) comprising a polymeric compound (A1) having a structural unit (a0) represented by general formula (a0-1) shown below:

OG Complex Work Unit Drawing
wherein R1 represents a hydrogen atom, a lower alkyl group or a halogenated lower alkyl group; A represents a divalent hydrocarbon group of 2 or more carbon atoms which may have a substituent; B represents a divalent hydrocarbon group of 1 or more carbon atoms which may have a substituent; and R2 represents an acid dissociable, dissolution inhibiting group.