| US 7,604,186 B2 | ||
| Process for preparing ground resin particles and apparatus for preparing the same | ||
| Yasuhiko Sawada, Settsu (Japan); Toshinari Tanaka, Settsu (Japan); Kazuhiko Shimada, Settsu (Japan); and Kazuhiro Mishima, Settsu (Japan) | ||
| Assigned to Daikin Industries, Ltd., Osaka (Japan) | ||
| Filed on Apr. 24, 2007, as Appl. No. 11/790,120. | ||
| Application 11/790120 is a division of application No. 10/297094, granted, now 7,237,732, previously published as PCT/JP01/04542, filed on May 30, 2001. | ||
| Claims priority of application No. 2000-165035 (JP), filed on Jun. 01, 2000; and application No. 2000-319668 (JP), filed on Oct. 19, 2000. | ||
| Prior Publication US 2007/0200015 A1, Aug. 30, 2007 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. B02C 19/00 (2006.01); B02C 1/00 (2006.01); B02C 23/18 (2006.01) | ||
| U.S. Cl. 241—1 [241/15] | 7 Claims |
| 1. A process for preparing ground resin particles by using a jet mill having
a plurality of jet nozzles disposed at predetermined positions in a barrel of a grinding chamber toward the injection point
located in the grinding chamber, and
a bottom wall having a flat surface in part or in whole, parallel to the jet nozzles,
the process comprising steps of:
jetting compressed air toward the central axis of the grinding chamber through the jet nozzles disposed in the grinding chamber
while resin particles consisting essentially of polytetrafluoroethylene to be ground are fluidized and continuously supplied
from the top or the bottom of the grinding chamber, thereby colliding the resin particles to be ground with each other to
grind the resin particles; and
collecting ground resin particles having an intended particle size.
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