| US 7,602,961 B2 | ||
| Reference data generating method, pattern defect checking apparatus, pattern defect checking method, reference data generating program, and semiconductor device manufacturing method | ||
| Ryoji Yoshikawa, Yokohama (Japan); and Hidehiro Watanabe, Tokyo (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Dec. 29, 2004, as Appl. No. 11/24,198. | ||
| Claims priority of application No. 2004-000516 (JP), filed on Jan. 05, 2004. | ||
| Prior Publication US 2005/0169513 A1, Aug. 04, 2005 | ||
| Int. Cl. G06K 9/00 (2006.01) | ||
| U.S. Cl. 382—148 [382/144] | 12 Claims |
| 1. A method of generating reference data for use in a comparison with sensed data obtained by picking up an image of a pattern
formed on an object, the method comprising:
generating, in a pattern expanding circuit, a two-value or multi-value gradated data of pixels in units of pixels from a design
data, and generating first processed data by multiplying a gradated value of a pixel targeted in the gradated data by a first
coefficient determined in accordance with gradated values of pixels located at a periphery of the targeted pixel; and
generating, in a reference data generation circuit;
second processed data by rounding up a gradated value of the pixel in the first processed data by a first threshold value;
third processed data by rounding down a gradated value of the pixel in the second processed data by a second threshold value;
fourth processed data by raising a gradated value of the pixel in the third processed data to a power of a second coefficient;
and
reference data based on the fourth processed data.
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