US 7,602,651 B2
Semiconductor integrated circuit device
Eiichi Makino, Yokohama (Japan); and Shigeo Ohshima, Kawasaki (Japan)
Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan)
Filed on Dec. 10, 2007, as Appl. No. 11/953,319.
Claims priority of application No. 2006-335792 (JP), filed on Dec. 13, 2006.
Prior Publication US 2008/0151640 A1, Jun. 26, 2008
Int. Cl. G11C 16/06 (2006.01)
U.S. Cl. 365—185.23  [365/185.18; 365/189.05; 365/230.06] 18 Claims
OG exemplary drawing
 
1. A semiconductor integrated circuit device outputting digital data from an internal circuit via a pad to the outside comprising:
a first transistor with a first conductive type which is connected between an output low voltage corresponding to a first logical value and the pad and which connects the output low voltage to the pad when the digital data has the first logical value;
a second transistor with a second conductive type which is connected between an output high voltage corresponding to a second logical value and the pad and which connects the output high voltage to the pad when the digital data has the second logical value; and
a third transistor with the first conductive type which is connected between the output high voltage and the pad so as to be parallel to the second transistor and which connects the output high voltage to the pad when the digital data has the second logical value.