| US 7,602,610 B2 | ||
| Electronic device | ||
| Hiroshi Ueda, Akishima (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Oct. 17, 2007, as Appl. No. 11/873,972. | ||
| Claims priority of application No. 2006-320374 (JP), filed on Nov. 28, 2006. | ||
| Prior Publication US 2008/0123263 A1, May 29, 2008 | ||
| Int. Cl. H05K 7/20 (2006.01) | ||
| U.S. Cl. 361—701 [361/702; 361/718; 165/80.4; 165/104.33; 257/E23.088] | 10 Claims |
| 1. An electronic device comprising:
a case;
a heat generating component mounted in the case;
a heat radiating part provided in the case;
a heat transfer unit including a heat receiving section thermally connected to the heat generating component, a heat radiating
section thermally connected to the heat radiating part, and a plurality of passages extending between the heat receiving section
and the heat radiating section and through which fluid flows; and
a pressing member facing the heat transfer unit,
wherein the heat transfer unit includes first and second members being flexible and mutually bonded,
the first member is flat in shape,
the second member includes a plurality of passage parts which form spaces to be the passages between the first member and
the second member, and a flat part being located between the adjacent passage parts and in contact with the first member,
and
the pressing member presses the flat part toward the heat generating component, avoiding the plurality of passage parts.
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