US 7,602,041 B2
Input protection circuit preventing electrostatic discharge damage of semiconductor integrated circuit
Shuuji Matsumoto, Kanagawa (Japan)
Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan)
Filed on May 27, 2008, as Appl. No. 12/127,611.
Application 12/127611 is a division of application No. 11/224938, filed on Sep. 14, 2005, granted, now 7,402,888.
Application 11/224938 is a division of application No. 10/702488, filed on Nov. 07, 2003, granted, now 6,969,892.
Claims priority of application No. 2003-113179 (JP), filed on Apr. 17, 2003.
Prior Publication US 2008/0230870 A1, Sep. 25, 2008
Int. Cl. H01L 29/00 (2006.01)
U.S. Cl. 257—529  [257/530; 438/132] 6 Claims
OG exemplary drawing
 
1. An intermediate product for a semiconductor integrated circuit having an input protection circuit, before being mounted on a circuit board, the input protection circuit comprising:
a semiconductor chip;
an internal circuit disposed on the semiconductor chip:
a plurality of terminal groups which are disposed on the semiconductor chip, having a plurality of input/output terminals linearly arranged on the semiconductor chip, the plurality of input/output terminals being connected respectively to the internal circuit;
a plurality of fusing parts disposed on the semiconductor chip and respectively disposed alternately between input/output terminals adjacent to each other among the plurality of input/output terminals so as to connect serially the plurality of input/output terminals in each of the plurality of terminal groups, each of the plurality of terminal groups forming a current path by an arrangement of the plurality of input/output terminals and the plurality of fusing parts; and
an electrical wiring disposed on the semiconductor chip, connecting the plurality of terminal groups to each other so that a current can flow from one current path to another current path through the electrical wiring;
wherein the plurality of fusing parts are respectively configured to be blown out so that the plurality of input/output terminals are electrically separated respectively from each other after the intermediate product is mounted on the circuit board.