| US 7,601,562 B2 | ||
| Microelectronic component assemblies having lead frames adapted to reduce package bow | ||
| Steven K. Groothuis, Rowlett, Tex. (US); Steven R. Smith, Boise, Id. (US); Steve Baughman, Meridian, Id. (US); Bernard Ball, Kuna, Id. (US); and T. Michael O'Connor, Kuna, Id. (US) | ||
| Assigned to Micron Technology, Inc., Boise, Id. (US) | ||
| Filed on Feb. 07, 2007, as Appl. No. 11/672,297. | ||
| Application 11/672297 is a division of application No. 10/386757, filed on Mar. 11, 2003, granted, now 7,183,485. | ||
| Prior Publication US 2007/0128770 A1, Jun. 07, 2007 | ||
| Int. Cl. H05K 5/06 (2006.01) | ||
| U.S. Cl. 438—111 [438/123; 174/536] | 22 Claims |
| 1. A method of manufacturing a microelectronic component assembly, comprising:
disposing a microelectronic component carrying a terminal onto a lead frame having a first lead frame member, a second lead
frame member spaced apart from the first lead frame member, and a plurality of leads each having an inner length and an outer
length;
electrically coupling an inner length of one of the leads to the terminal of the microelectronic component;
covering the terminal and the inner lengths of each of the leads with a mold compound, leaving the outer length of each of
the leads extending outwardly beyond a periphery of the mold compound;
interconnecting the exposed lengths of the leads with a dam bar;
attaching the dam bar to the first lead frame member by a flexible first dam connector and to the second lead frame member
by a flexible second dam connector, at least one of the first and second dam connectors including a flexible transverse length;
and
permitting the dam bar to move laterally with respect to the first and second lead frame members in response to thermal stresses
caused as the mold compound cools from a first temperature to a second temperature.
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