| US 7,601,561 B2 | ||
| Heat-radiating tape carrier package and method for manufacturing the same | ||
| Yun-Hyeok Im, Yongin-si (Korea, Republic of); Dong-Han Kim, Osan-si (Korea, Republic of); and Jae-Wook Yoo, Suwon-si (Korea, Republic of) | ||
| Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (Korea, Republic of) | ||
| Filed on Oct. 25, 2006, as Appl. No. 11/585,962. | ||
| Claims priority of application No. 10-2006-0025166 (KR), filed on Mar. 20, 2006. | ||
| Prior Publication US 2007/0216016 A1, Sep. 20, 2007 | ||
| Int. Cl. H01L 21/44 (2006.01); H01L 29/40 (2006.01); H01L 23/29 (2006.01) | ||
| U.S. Cl. 438—109 [257/777] | 23 Claims |
| 1. A method for manufacturing a tape carrier package comprising:
inner lead bonding a semiconductor element having an active surface to a tape wiring substrate having a window;
attaching a first surface of an interposer to the active surface of the semiconductor element through the window; and
attaching a heat sink to a second surface of the interposer.
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