| US 7,601,229 B2 | ||
| Process for producing soft magnetism material, soft magnetism material and powder magnetic core | ||
| Haruhisa Toyoda, Itami (Japan); Hirokazu Kugai, Itami (Japan); Kazuhiro Hirose, Itami (Japan); Naoto Igarashi, Itami (Japan); and Takao Nishioka, Itami (Japan) | ||
| Assigned to Sumitomo Electric Industries Ltd., Osaka (Japan) | ||
| Appl. No. 10/595,314 PCT Filed Oct. 01, 2004, PCT No. PCT/JP2004/014477 § 371(c)(1), (2), (4) Date Apr. 07, 2006, PCT Pub. No. WO2005/038829, PCT Pub. Date Apr. 28, 2005. |
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| Claims priority of application No. 2003-354940 (JP), filed on Oct. 15, 2003; application No. 2003-356031 (JP), filed on Oct. 16, 2003; and application No. 2004-024256 (JP), filed on Jan. 30, 2004. | ||
| Prior Publication US 2007/0102066 A1, May 10, 2007 | ||
| Int. Cl. H01F 1/20 (2006.01); H01F 1/24 (2006.01) | ||
| U.S. Cl. 148—306 [148/307; 148/309; 148/310; 148/311; 148/312; 148/313; 75/255; 428/472.3] | 5 Claims |
| 1. A soft magnetic powder comprising a plurality of compound magnetic particles, the plurality of compound magnetic particles comprising a plurality of metal magnetic particles and electrically insulating film surrounding surfaces of said metal magnetic particles; wherein said metal magnetic particles are iron comprising particles; wherein said metal magnetic particles have a coercivity of no more than 2.0×102 A/m and said metal magnetic particles have a particle diameter distribution that is essentially in a range of at least 38 microns and less than 355 microns; and wherein the thickness of said insulating film is at least 0.005 microns and less than or equal to 20 microns. |