US 7,601,008 B2
Socket adaptor apparatus
Hideyuki Takahashi, Shizuokaken (Japan); and Kiyokazu Ikeya, Shizuokaken (Japan)
Assigned to Sensata Technologies, Inc., Attleboro, Mass. (US)
Filed on Jun. 10, 2008, as Appl. No. 12/136,460.
Claims priority of application No. 2007-179444 (JP), filed on Jul. 09, 2007.
Prior Publication US 2009/0017703 A1, Jan. 15, 2009
Int. Cl. H01R 12/00 (2006.01)
U.S. Cl. 439—70  [439/700; 439/841; 439/81] 7 Claims
OG exemplary drawing
 
1. A socket adaptor for connection to a socket that mounts a semiconductor device comprises a main adaptor body made of an electrically insulating material, a plurality of through holes formed therethrough, said through holes including an upper opening and a lower opening, a probe pin made of electrically conductive material accommodlated in each said through hole, each probe pin having a clip portion that electrically engages a contact inserted from said upper surface opening and each probe pin having on its lower part a tip portion that can protrude from said lower opening, a slot formed along the through hole and in communication therewith in said main adaptor body, with said probe pin being able to slide inside said slot, and a spring member accommodated in each through hole to bias said probe pin so that said tip portion can protrude from the lower opening, said tip portion movable back through the through hole in opposition to the bias of said spring member, wherein said main adaptor body comprises an upper and a lower adaptor portion with said upper adaptor portion including a protuberant part that protrudes into the imaginary continuation of the through hole of the lower adaptor portion, said protuberant part causing directly the limiting movement of one end of said spring member that has been accommodated in the through hole of the lower adaptor portion.