| US 7,600,432 B2 | ||
| Pressure sensor with sensing chip protected by protective material | ||
| Takashi Nomura, Kariya (Japan); Hironobu Baba, Oobu (Japan); and Yoshifumi Watanabe, Kariya (Japan) | ||
| Assigned to Denso Corporation, Kariya (Japan) | ||
| Filed on Oct. 11, 2007, as Appl. No. 11/907,400. | ||
| Claims priority of application No. 2006-278426 (JP), filed on Oct. 12, 2006. | ||
| Prior Publication US 2008/0264174 A1, Oct. 30, 2008 | ||
| Int. Cl. G01L 9/00 (2006.01) | ||
| U.S. Cl. 73—706 [73/756] | 7 Claims |
| 1. A pressure sensor, comprising:
a case made of resin and formed to a corner;
a sensing chip mounted in the case to sense pressure applied to the sensing chip; and
a protective material arranged in the case to cover the sensing chip for protection thereof, the corner contacting the protective
material arranged in the case, wherein the proactive material is composed of a first protective material arranged to contact
the corner and a second protective material arranged to cover the first protective material, formed to be softer from the
first protective material, and arranged to contact the sensing chip; and
a dam portion protruded from the case to prevent the first protective material from shifting toward the second protective
material.
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