| US 7,597,233 B2 | ||
| Apparatus and method of mounting conductive ball | ||
| Hideaki Sakaguchi, Nagano (Japan); and Kiyoaki Iida, Nagano (Japan) | ||
| Assigned to Shinko Electric Industries Co., Ltd., Nagano-shi (Japan) | ||
| Filed on Jul. 23, 2008, as Appl. No. 12/178,270. | ||
| Claims priority of application No. 2007-192018 (JP), filed on Jul. 24, 2007. | ||
| Prior Publication US 2009/0026247 A1, Jan. 29, 2009 | ||
| Int. Cl. B23K 1/00 (2006.01); B23K 35/14 (2006.01); B23K 31/00 (2006.01); B23K 35/12 (2006.01) | ||
| U.S. Cl. 228—41 [228/56.3; 228/180.22; 228/245; 228/246] | 2 Claims |
| 1. A conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of connection pads formed
on a substrate, comprising:
an outer frame;
an inner cylinder provided in the outer frame, wherein an upper surface and a lower surface of the inner cylinder are opened;
a sieve provided in the inner cylinder, wherein the inner cylinder is partitioned into an upper space and a lower space by
the sieve;
an inlet port for supplying an air from an outside to the lower space of the inner cylinder;
a mask provided to a lower end of the outer frame and having openings, the openings being provided to correspond to conductive
ball mounting positions; and
an exhaust port for exhausting an air from an upper surface of the mask to the outside and being provided to the lower end
of the outer frame,
wherein the inner cylinder is adapted to vibrate without being restricted by the outer frame.
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