| US 7,593,564 B2 | ||
| Method and apparatus for reviewing defect of subject to be inspected | ||
| Kenji Obara, Kawasaki (Japan); and Kazuo Aoki, Hitachinaka (Japan) | ||
| Assigned to Hitachi High-Technologies Corporation, Tokyo (Japan) | ||
| Filed on Nov. 15, 2005, as Appl. No. 11/272,897. | ||
| Claims priority of application No. 2004-332811 (JP), filed on Nov. 17, 2004. | ||
| Prior Publication US 2006/0104500 A1, May 18, 2006 | ||
| Int. Cl. G06K 9/00 (2006.01) | ||
| U.S. Cl. 382—141 | 4 Claims |
| 3. A defect reviewing method for inputting position coordinates of a defect obtained by an inspection apparatus and displaying
a magnified image of said defect by means of a defect reviewing apparatus, the method comprising steps of:
preparing a calibrating substrate having a defect whose position has been known and whose coordinates are called absolute
coordinates; and
detecting a position of said defect of said calibrating substrate by means of said inspection apparatus, and outputting said
detected position as inspection coordinates,
wherein the method further comprises steps executed by a processor included in a defect data analyzing/computing portion disposed
in said defect reviewing apparatus, the steps executed by the computer comprising:
comparing said inspection coordinates with said absolute coordinates, and determining a deviation between said inspection
coordinates and said absolute coordinates as an error due to said inspection apparatus;
extracting nonrandom errors from said error, and removing said nonrandom errors from said inspection coordinates;
determining an error included in said inspection coordinates from which said nonrandom errors have been removed, as a random
error;
setting a view size for defect search in said defect reviewing apparatus based on said random error included in said inspection
coordinates;
determining a correlation between a detected value of a defect size of said calibrating substrate detected by means of said
inspection apparatus and a real value of said defect size measured in advance; and
selecting a defect in which said correlation is higher than a predetermined threshold value, as a defect suitable for fine
alignment.
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