| US 7,592,569 B2 | ||
| Substrate processing apparatus, pressure control method for substrate processing apparatus and recording medium having program recorded therein | ||
| Taketoshi Okajo, Yamanashi (Japan) | ||
| Assigned to Tokyo Electron Limited, Tokyo (Japan) | ||
| Filed on Oct. 21, 2005, as Appl. No. 11/254,670. | ||
| Claims priority of provisional application 60/635489, filed on Dec. 14, 2004. | ||
| Claims priority of application No. 2004-306522 (JP), filed on Oct. 21, 2004. | ||
| Prior Publication US 2006/0086259 A1, Apr. 27, 2006 | ||
| Int. Cl. C23C 16/00 (2006.01); F27D 11/00 (2006.01) | ||
| U.S. Cl. 219—385 [118/725] | 6 Claims |
| 1. A substrate processing apparatus, comprising:
a processing chamber in which a substrate is processed by using a processing gas;
a partitioning plate that is disposed inside said processing chamber so as to partition said processing chamber into a processing
space in which the substrate is processed and an evacuation space through which said processing chamber is evacuated, having
formed therein a plurality of communicating holes communicating between said processing space and said evacuation space;
a processing gas supply means for supplying the processing gas into said processing space within said processing chamber;
a pressure adjusting gas supply means for supplying a pressure adjusting gas to be used to adjust the pressure inside said
processing chamber into said evacuation space within said processing chamber; and
a pressure control means for executing pressure control by supplying the pressure adjusting gas into said evacuation space
via said pressure adjusting gas supply means while supplying the processing gas into said processing space via said processing
gas supply means, so as to set the pressure in said processing space to a predetermined level.
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