| US 7,592,551 B2 | ||
| Wired circuit board assembly sheet | ||
| Toshiki Naito, Osaka (Japan); Tetsuya Ohsawa, Osaka (Japan); and Kouji Kataoka, Osaka (Japan) | ||
| Assigned to Nitto Denko Corporation, Osaka (Japan) | ||
| Filed on Apr. 13, 2007, as Appl. No. 11/783,999. | ||
| Claims priority of application No. 2006-111163 (JP), filed on Apr. 13, 2006. | ||
| Prior Publication US 2007/0241764 A1, Oct. 18, 2007 | ||
| Int. Cl. H05K 1/00 (2006.01) | ||
| U.S. Cl. 174—250 [174/255] | 1 Claim |
| 1. A wired circuit board assembly sheet comprising:
a plurality of wired circuit boards;
distinguishing marks for distinguishing defectiveness of the wired circuit boards;
a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks;
wherein each of the distinguishing marks comprises an indication portion for indicating a specified wired circuit board;
wherein the supporting sheet has openings formed in the portions where the distinguishing marks are provided; and
wherein each of the distinguishing marks comprises:
a removal portion provided in the opening for indicating whether the corresponding wired circuit board is defective or non-defective;
and
a joint portion made of resin for jointing the removal portion to the supporting sheet.
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