| US 7,586,096 B2 | ||
| Interface assembly for thermally coupling a data acquisition system to a sensor array | ||
| Oliver Richard Astley, Clifton Park, N.Y. (US); James Wilson Rose, Guilderland, N.Y. (US); Joe James Lacey, Cambridge, Wis. (US); Jonathan David Short, Saratoga Springs, N.Y. (US); and Ashutosh Joshi, Waukesha, Wis. (US) | ||
| Assigned to General Electric Company, Niskayuna, N.Y. (US) | ||
| Filed on Nov. 17, 2006, as Appl. No. 11/560,873. | ||
| Prior Publication US 2008/0116387 A1, May 22, 2008 | ||
| Int. Cl. G01T 1/24 (2006.01) | ||
| U.S. Cl. 250—370.15 | 18 Claims |
| 1. A system comprising:
a sensor array based on a given sensing modality;
at least one integrated circuit for providing a desired signal conditioning to a plurality of analog signals from the sensor
array, wherein the at least one integrated circuit is directly mounted on to the sensor array establishing thermal coupling
there between; and
at least one temperature sensor configured to sense temperature variation affecting the sensor array, the at least one temperature
sensor disposed in a location selected from at least one of the following locations: a location at the sensor array, and a
location within the integrated circuit, wherein the temperature sensor comprises a sensor element disposed at the sensor array
but outside a field of view of the sensor array, the sensor element being of a type as used in the sensor array and comprising
a cover to shield radiation from exciting the sensor element.
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