| US 7,577,039 B2 | ||
| Memory interface to bridge memory buses | ||
| Howard Yang, Shanghai (China); Stephen Tai, Shanghai (China); Gang Shan, Shanghai (China); and Larry Wu, Shanghai (China) | ||
| Assigned to Montage Technology Group, Ltd., Tortola (Virgin Islands (British)) | ||
| Filed on Aug. 10, 2006, as Appl. No. 11/463,822. | ||
| Application 11/463822 is a continuation in part of application No. 11/281211, filed on Nov. 16, 2005, granted, now 7,368,950. | ||
| Application 11/281211 is a continuation in part of application No. 11/277650, filed on Mar. 28, 2006, granted, now 7,558,124. | ||
| Prior Publication US 2007/0162670 A1, Jul. 12, 2007 | ||
| Int. Cl. G11C 7/10 (2006.01) | ||
| U.S. Cl. 365—189.05 [365/189.17; 365/219; 365/233.13] | 16 Claims |
| 1. A printed circuit board, comprising:
at least one memory interface buffer chip to connect an advanced memory buffer (AMB) interface and a parallel memory bus on
a motherboard for one or more non-fully buffered memory modules.
|