| US 7,576,430 B2 | ||
| Bonding structure | ||
| Shyh-Ming Chang, Hsinchu (Taiwan); and Sheng-Shu Yang, Hsinchu (Taiwan) | ||
| Assigned to Taiwan TFT LCD Association, Hsinchu (Taiwan); Chunghwa Picture Tubes, Ltd., Taoyuan (Taiwan); Au Optronics Corporation, Hsinchu (Taiwan); Hannstar Display Corporation, Taipei (Taiwan); Chi Mei Optoelectronics Corporation, Tainan County (Taiwan); Industrial Technology Research Institute, Hsinchu (Taiwan); and TPO Dispalys Corp., Miao-Li County (Taiwan) | ||
| Filed on Jan. 31, 2007, as Appl. No. 11/669,160. | ||
| Claims priority of application No. 95139501 A (TW), filed on Oct. 26, 2006. | ||
| Prior Publication US 2008/0099916 A1, May 01, 2008 | ||
| Int. Cl. H01L 23/48 (2006.01) | ||
| U.S. Cl. 257—738 [438/613] | 11 Claims |
| 1. A bonding structure, comprising:
a first substrate comprising a plurality of first bonding pads;
a second substrate disposed on one side of the first substrate and including a plurality of second bonding pads and a plurality
of compliant bumps disposed on the second bonding pads, respectively, wherein the second bonding pads on the second substrate
are electrically connected to the first bonding pads on the first substrate through the compliant bumps, respectively;
a non-conductive adhesive layer disposed between the first substrate and the second substrate; and
a plurality of ball-shaped spacers distributed in the non-conductive adhesive layer to maintain the gap between the first
and second substrates, wherein the ball-shaped spacers are nonconductive.
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