| US 7,572,675 B2 | ||
| Mold flash removal process for electronic devices | ||
| Srikanth Narasimalu, Singapore (Singapore); and Premkumar Jeromerajan, Singapore (Singapore) | ||
| Assigned to ASM Technology Singapore Pte Ltd., Singapore (Singapore) | ||
| Filed on Jan. 24, 2006, as Appl. No. 11/338,206. | ||
| Prior Publication US 2007/0170602 A1, Jul. 26, 2007 | ||
| Int. Cl. H01L 21/00 (2006.01) | ||
| U.S. Cl. 438—115 | 20 Claims |
| 1. Method for removing excess encapsulation material from unmolded surfaces of a molded substrate including semiconductor
packages, comprising the steps of:
mounting the substrate to a holding device with the unmolded surfaces facing an acid source for supplying an acid solution;
contacting the unmolded surfaces with the acid solution for a sufficient time to remove the excess encapsulation material
from the unmolded surfaces while substantially avoiding contact of the acid with molded surfaces of the molded substrate;
and thereafter
removing the substrate from contact with the acid solution.
|