US 7,566,758 B2
Epoxy resin composition
Akihiko Shimomura, Kanagawa (Japan); Hiromichi Noguchi, Tokyo (Japan); and Isao Imamura, Kanagawa (Japan)
Assigned to Canon Kabushiki Kaisha, Tokyo (Japan)
Filed on Dec. 01, 2005, as Appl. No. 11/290,539.
Application 11/290539 is a division of application No. 10/341373, filed on Jan. 14, 2003, granted, now 7,074,273.
Claims priority of application No. 2002-008441 (JP), filed on Jan. 17, 2002.
Prior Publication US 2006/0089466 A1, Apr. 27, 2006
Int. Cl. C08L 63/00 (2006.01)
U.S. Cl. 525—525  [525/116; 522/111; 522/112; 118/302] 2 Claims
OG exemplary drawing
 
1. An epoxy resin composition, comprising:
(i) a first epoxy resin having a polydispersity ranging from 3.5 to 5.0, wherein the first epoxy resin is represented by formula (A1-1) or (A1-2):

OG Complex Work Unit Drawing
wherein a/b=5/3 and Mn=14,000;

OG Complex Work Unit Drawing
wherein a/d=5/3 and Mn=15,000;
(ii) a second epoxy resin having a polydispersity ranging from 1.5 to 3.0, wherein the second epoxy resin is represented by formula (A2−1):

OG Complex Work Unit Drawing
wherein a/d=3/1 and Mn=4,000; and
(iii) a cationic polymerization catalyst.