| US 7,566,116 B2 | ||
| Ink jet head circuit board, method of manufacturing the same and ink jet head using the same | ||
| Ichiro Saito, Yokohama (Japan); Toshiyasu Sakai, Yokohama (Japan); Teruo Ozaki, Yokohama (Japan); Sakai Yokoyama, Kawasaki (Japan); Kenji Ono, Setagaya-Ku (Japan); Satoshi Ibe, Yokohama (Japan); and Kazuaki Shibata, Kawasaki (Japan) | ||
| Assigned to Canon Kabushiki Kaisha, Tokyo (Japan) | ||
| Filed on Nov. 02, 2005, as Appl. No. 11/264,160. | ||
| Claims priority of application No. 2004-325534 (JP), filed on Nov. 09, 2004. | ||
| Prior Publication US 2006/0098053 A1, May 11, 2006 | ||
| Int. Cl. B41J 2/05 (2006.01) | ||
| U.S. Cl. 347—64 [347/59] | 5 Claims |
| 1. An ink jet head circuit board having a heater for generating thermal energy to be used for ejecting ink in response to
application of electricity, the ink jet head comprising:
an electrode wire layer including a first gap;
a resistor layer disposed as an upper layer of the electrode wire layer inclusive of the first gap;
a first protective layer disposed as an upper layer of the resistor layer; and
a second protective layer including a second gap, disposed as an upper layer of the first protective layer,
wherein a portion of the resistor layer corresponding to the first gap becomes the heater, the second protective layer is
not formed on the heater, the second protective layer is positioned on the first gap, and the second gap is wider than the
first gap.
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