| US 7,563,652 B2 | ||
| Method for encapsulating sensor chips | ||
| Kuo-Pin Yang, Kaohsiung County (Taiwan); and Wei-Min Hsiao, Kaohsiung (Taiwan) | ||
| Assigned to Advanced Semiconductor Engineering Inc., Kaohsiung (Taiwan) | ||
| Filed on Dec. 28, 2006, as Appl. No. 11/617,195. | ||
| Claims priority of application No. 95124955 A (TW), filed on Jul. 07, 2006. | ||
| Prior Publication US 2008/0009102 A1, Jan. 10, 2008 | ||
| Int. Cl. H01L 21/44 (2006.01); H01L 21/48 (2006.01) | ||
| U.S. Cl. 438—126 [438/127; 438/26; 438/64; 438/113; 257/787; 257/434; 257/E21.499] | 14 Claims |
| 1. A method for encapsulating sensor chips, comprising steps of:
providing a sensor chip having an active surface, a back surface opposite to the active surface, and a plurality of side surfaces
defined between the active surface and the back surface, wherein the active surface has a plurality of bonding pads formed
thereon and includes a sensor region;
forming a protective layer on the active surface of the sensor chip, wherein the protective layer at least covers the sensor
region;
attaching the sensor chip to a temporary carrier, wherein the active surface of the sensor chip faces to the temporary carrier,
and is attached to the temporary carrier via the protective layer;
forming an encapsulant on the temporary carrier, wherein the encapsulant covers the back surface and the side surfaces of
the sensor chip;
removing the temporary carrier; and
forming a plurality of electrically connecting components in the encapsulant, wherein the electrically connecting components
are electrically connected to the bonding pads of the sensor chip.
|