| US 7,563,110 B2 | ||
| Multiple wavelength sensor interconnect | ||
| Ammar Al-Ali, Tustin, Calif. (US); and Yassir Abdul-Hafiz, Irvine, Calif. (US) | ||
| Assigned to Masimo Laboratories, Inc., Irvine, Calif. (US) | ||
| Filed on May 23, 2008, as Appl. No. 12/126,702. | ||
| Application 12/126702 is a continuation of application No. 11/366210, filed on Mar. 01, 2006, granted, now 7,377,794. | ||
| Claims priority of provisional application 60/657596, filed on Mar. 01, 2005. | ||
| Claims priority of provisional application 60/657281, filed on Mar. 01, 2005. | ||
| Claims priority of provisional application 60/657268, filed on Mar. 01, 2005. | ||
| Claims priority of provisional application 60/657759, filed on Mar. 01, 2005. | ||
| Prior Publication US 2008/0220633 A1, Sep. 11, 2008 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01R 12/00 (2006.01) | ||
| U.S. Cl. 439—77 [439/909] | 9 Claims |
| 6. A sensor flex circuit comprising:
an emitter end;
a detector end,
an elongated interconnect between the emitter end and the detector end; and
a cable connector extending from the interconnect,
wherein the emitter end has emitter pads for physically attaching and electrically connecting an emitter assembly.
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