| US 7,548,666 B2 | ||
| Solid state imaging device and method for manufacturing the same | ||
| Toshihiro Kuriyama, Shiga (Japan); and Atsushi Tomozawa, Osaka (Japan) | ||
| Assigned to Panasonic Corporation, Osaka (Japan) | ||
| Filed on Oct. 19, 2006, as Appl. No. 11/582,984. | ||
| Claims priority of application No. 2006-016054 (JP), filed on Jan. 25, 2006. | ||
| Prior Publication US 2007/0170477 A1, Jul. 26, 2007 | ||
| Int. Cl. G02B 6/12 (2006.01) | ||
| U.S. Cl. 385—14 | 5 Claims |
| 1. A solid state imaging device including a plurality of light receiving elements arranged in a substrate such that a substrate
region is defined between adjacent light receiving elements, the solid state image device comprising:
first optical waveguides formed above the light receiving elements;
second optical waveguides formed over the respective substrate regions; and
condenser lenses provided in the same arrangement as the light receiving elements and the first optical waveguides when viewed
in plan, wherein
the second optical waveguides are positioned between the condenser lenses when viewed in plan.
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