US 7,548,632 B2
Speaker, module using the same, electronic equipment and device, and speaker producing method
Takanori Fukuyama, Mie (Japan); Tomoyasu Takase, Mie (Japan); Koji Sano, Mie (Japan); Hiroshi Yano, Mie (Japan); Masanori Nakano, Mie (Japan); Shigeru Tomoeda, Mie (Japan); Kazuki Honda, Mie (Japan); Kazuya Yamasaki, Osaka (Japan); Kazutaka Kubo, Mie (Japan); Takeshi Shimokawatoko, Mie (Japan); Mitsutaka Enomoto, Mie (Japan); and Masahide Sumiyama, Mie (Japan)
Assigned to Panasonic Corporation, Osaka (Japan)
Appl. No. 10/590,144
PCT Filed Mar. 17, 2005, PCT No. PCT/JP2005/004763
§ 371(c)(1), (2), (4) Date Aug. 21, 2006,
PCT Pub. No. WO2005/099305, PCT Pub. Date Oct. 20, 2005.
Claims priority of application No. 2004-103775 (JP), filed on Mar. 31, 2004; and application No. 2004-197561 (JP), filed on Jul. 05, 2004.
Prior Publication US 2007/0140519 A1, Jun. 21, 2007
Int. Cl. H04R 1/00 (2006.01); H04R 9/06 (2006.01); H04R 11/02 (2006.01)
U.S. Cl. 381—429  [381/398; 381/430; 181/171] 15 Claims
OG exemplary drawing
 
1. A speaker comprising:
a magnet circuit assembly including
a frame, and
a permanent magnet;
a diaphragm assembly including
a diaphragm, and
a voice coil attached to an outer peripheral portion of said diaphragm; and
an edge supporting said diaphragm with respect to said frame, an outer periphery of said edge being connected to said frame, and an inner periphery of said edge being connected to a joint part of said diaphragm, said joint part being disposed inwardly of said outer peripheral portion of said diaphragm;
wherein said diaphragm has a through hole formed therethrough in a thickness direction thereof, said through hole being located outwardly of said joint part of said diaphragm and inwardly of said outer peripheral portion of said diaphragm such that said outer peripheral portion of said diaphragm is interposed between said through hole and said voice coil.