| US 7,548,304 B2 | ||
| Chuck plate assembly with cooling means | ||
| Sang Jin Han, Suwon (Korea, Republic of); Sung Ho Lee, Yongin (Korea, Republic of); Myung Soo Huh, Suwon (Korea, Republic of); Seok Heon Jeong, Yongin (Korea, Republic of); Kwan Seop Song, Suwon (Korea, Republic of); and Hee Cheol Kang, Suwon (Korea, Republic of) | ||
| Assigned to Samsung Mobile Display Co., Ltd., Suwon-Si (Korea, Republic of) | ||
| Filed on Dec. 12, 2005, as Appl. No. 11/298,566. | ||
| Claims priority of application No. 10-2005-0000965 (KR), filed on Jan. 05, 2005; and application No. 10-2005-0000966 (KR), filed on Jan. 05, 2005. | ||
| Prior Publication US 2006/0154407 A1, Jul. 13, 2006 | ||
| Int. Cl. G03B 27/62 (2006.01); G03B 27/52 (2006.01); C23C 14/00 (2006.01); C23C 16/00 (2006.01) | ||
| U.S. Cl. 355—75 [355/30; 204/298.09; 204/298.11; 118/720] | 17 Claims |

| 1. A chuck plate assembly, comprising:
a shadow mask formed with a predetermined pattern;
a shadow mask frame to which the shadow mask is attached;
a cooling plate mounted on a portion of the shadow mask frame exposed to a deposition source,
wherein the cooling plate has an inner portion extending towards a film growth region, the inner portion having a tapered
profile.
|