US 7,528,347 B2
Cooling device and heat treating device using the same
Takanori Saito, Tokyo-To (Japan); and Kenichi Yamaga, Tokyo-To (Japan)
Assigned to Tokyo Electron Limited, Tokyo (Japan)
Appl. No. 10/505,900
PCT Filed Feb. 28, 2003, PCT No. PCT/JP03/02383
§ 371(c)(1), (2), (4) Date Aug. 27, 2004,
PCT Pub. No. WO03/073485, PCT Pub. Date Sep. 04, 2003.
Claims priority of application No. 2002-054543 (JP), filed on Feb. 28, 2002.
Prior Publication US 2005/0225937 A1, Oct. 13, 2005
Int. Cl. F27B 5/14 (2006.01)
U.S. Cl. 219—390  [219/405; 219/411; 392/416; 392/418; 118/724; 118/725; 118/50.1] 16 Claims
OG exemplary drawing
 
1. A thermal processing system comprising:
a vertical processing vessel configured to contain therein process objects at vertical intervals;
a heater disposed outside the processing vessel to heat the process objects contained in the processing vessel; and
a vertically-extending, cooling tube surrounding the processing vessel and the heater, said cooling tube including:
a metallic tubular base member having an inner surface facing the processing vessel and the heater and having an outer surface; and
a metallic pipe member wound around the outer surface of the base member, brazed to the outer surface of the base member, and configured to allow a coolant to flow therethrough,
wherein the pipe member has a cross section of a rectangle, and a first surface opposing the outer surface of the base member and corresponding to a side of the rectangle, the first surface of the pipe member being brazed to the outer surface of the base member, whereby the first surface of the pipe member is bonded to the outer surface of the tubular base member via a brazing filler metal, and
wherein vertically-opposed, adjacent surfaces of the pipe member are bonded to each other via a brazing filler metal.