| US 7,526,858 B2 | ||
| Apparatus for making electronic devices | ||
| Masashi Kasuga, Suwa (Japan); Tomoyuki Kamakura, Matsumoto (Japan); Wakao Miyazawa, Chino (Japan); and Fukumi Tsuchihashi, Chino (Japan) | ||
| Assigned to Seiko Epson Corporation, Tokyo (Japan) | ||
| Filed on Oct. 04, 2006, as Appl. No. 11/542,202. | ||
| Application 11/542202 is a division of application No. 10/420882, filed on Apr. 23, 2003, granted, now 7,127,810. | ||
| Claims priority of application No. 2002-124866 (JP), filed on Apr. 25, 2002. | ||
| Prior Publication US 2007/0028444 A1, Feb. 08, 2007 | ||
| Int. Cl. B23P 19/00 (2006.01) | ||
| U.S. Cl. 29—729 [29/739; 29/740; 29/720; 29/721] | 22 Claims |
| 1. An apparatus for manufacturing electronic devices, comprising:
a laser device to generate laser beams;
a masking unit having a masking substrate to shape beam spots of the laser beams;
a first stage to place a first substrate which carries an object to be transferred;
a second stage to place a second substrate to which the object to be transferred is transferred;
an adhesive agent applying unit to apply an adhesive agent on the object to be transferred or on a transferred position on
the second substrate; and
a control unit to control at least one of the first and the second stages, the control unit transferring the object to be
transferred from the first substrate to the second substrate by moving at least one of the first and the second stages to
perform an inter-substrate alingment of the masking substrate, the first and the second substrates, adhering the first and
the second substrates, irradiating a laser beam onto the object to be transferred, and moving the first and the second substrates
away from each other.
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