| US D590,797 S | ||
| Housing for a communication device | ||
| Mark D. Finney, Chicago, Ill. (US); Sung-Gul Hwang, Seoul (Korea, Republic of); and Paul M. Pierce, Grayslake, Ill. (US) | ||
| Assigned to Motorola Inc, Schaumburg, Ill. (US) | ||
| Filed on Jan. 09, 2008, as Appl. No. 29/302,028. | ||
| Application 29/302028 is a continuation of application No. 29/247422, filed on Jun. 16, 2006, abandoned. | ||
| This patent is subject to a terminal disclaimer. | ||
| Term of patent 14 Years | ||
| LOC (9) Cl. 14 - 03 | ||
| U.S. Cl. D14—138 |
| The ornamental design for a housing for a communication device, as shown and described. |