| US 7,521,793 B2 | ||
| Integrated circuit mounting for thermal stress relief useable in a multi-chip module | ||
| Iyad Alhayek, Schaumburg, Ill. (US); Gerry Bianco, Elgin, Ill. (US); Juergen Broszeit, Neubiberg (Germany); Gregory R. Gayowsky, Barrington, Ill. (US); Ilko Schmadlak, Feldkirchen (Germany); and George Sotiropoulos, Des Plaines, Ill. (US) | ||
| Assigned to Temic Automotive of North America, Inc., Deer Park, Ill. (US) | ||
| Filed on Sep. 26, 2005, as Appl. No. 11/234,937. | ||
| Prior Publication US 2007/0090522 A1, Apr. 26, 2007 | ||
| Int. Cl. H01L 23/34 (2006.01) | ||
| U.S. Cl. 257—712 [257/774] | 20 Claims |
| 1. A system for mounting an integrated circuit, comprising:
a substrate having a surface and having a plurality of substrate contacts disposed on the surface;
a mounting structure mounted to the substrate, the mounting structure comprising an electrically insulating surface on which
are disposed a plurality of mounting structure contacts and a heat spreading region, wherein at least one of the mounting
structure contacts is electrically connected to one of the substrate contacts; and
an integrated circuit mounted on the heat spreading region of mounting structure, the integrated circuit comprising a plurality
of integrated circuit bond pads, wherein at least one of the integrated circuit bond pads is electrically connected to the
at least one of the mounting structure contacts.
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