| US 7,518,873 B2 | ||
| Heat spreader, semiconductor package module and memory module having the heat spreader | ||
| Chang-Yong Park, Cheonan-si (Korea, Republic of); Hyun-Jong Oh, Cheonan-si (Korea, Republic of); Yong-Hyun Kim, Suwon-si (Korea, Republic of); Dong-Woo Shin, Cheonan-si (Korea, Republic of); Kyung-Du Kim, Daejeon (Korea, Republic of); Dong-Chun Lee, Cheonan-si (Korea, Republic of); and Kwang-Ho Chun, Asan-si (Korea, Republic of) | ||
| Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (Korea, Republic of) | ||
| Filed on Jul. 06, 2006, as Appl. No. 11/481,179. | ||
| Claims priority of application No. 10-2005-0061309 (KR), filed on Jul. 07, 2005. | ||
| Prior Publication US 2007/0008703 A1, Jan. 11, 2007 | ||
| Int. Cl. H05K 7/20 (2006.01); H01L 23/34 (2006.01); F28F 7/00 (2006.01) | ||
| U.S. Cl. 361—710 [361/704; 361/711; 257/718; 165/185] | 37 Claims |
| 1. A heat spreader comprising:
a heat sinking plate configured to radiate heat away from a heat source; and
a pressure clip including the following,
a spine arranged on the heat sinking plate,
hook parts that extend from both ends of the spine to engage the heat source, and
one or more ribs that extend from sides of the spine and contact the spine, and not the heat sinking plate, at one end of
the rib and a top surface of the heat sinking plate at the other end of the rib.
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