| US 7,518,234 B1 | ||
| MEMS direct chip attach packaging methodologies and apparatuses for harsh environments | ||
| Robert S. Okojie, Strongsville, Ohio (US) | ||
| Assigned to The United States of America as represented by the Administrator of the National Aeronautics and Space Admistration, Washington, D.C. (US) | ||
| Filed on Aug. 25, 2004, as Appl. No. 10/926,206. | ||
| Application 10/926206 is a division of application No. 10/263980, filed on Oct. 03, 2002, granted, now 6,845,664. | ||
| Int. Cl. H01L 23/10 (2006.01) | ||
| U.S. Cl. 257—710 | 7 Claims |
| 1. A packaged sensor comprising:
a bottom substrate having a housing;
a sensor having a perimeter residing in said housing;
a top substrate having a cover;
said cover having a perimeter; and,
said perimeter of said cover and said perimeter of said sensor being hermetically sealed to said housing of said bottom substrate.
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