| US 7,518,233 B1 | ||
| Sealing structure for multi-chip module | ||
| Kouichi Takahashi, Sagamihara (Japan); Kenichi Kasai, Ushiku (Japan); Takahiro Daikoku, Ushiku (Japan); Takayuki Uda, Hadano (Japan); Toshitada Netsu, Hadano (Japan); Takeshi Yamaguchi, Hadano (Japan); Takahiko Matsushita, Hadano (Japan); and Osamu Maruyama, Hadano (Japan) | ||
| Assigned to Hitachi, Ltd., Tokyo (Japan); and Hitachi Information Technology Co., Ltd., Kanagawa (Japan) | ||
| Filed on Jun. 09, 2000, as Appl. No. 9/590,897. | ||
| Claims priority of application No. 11-162046 (JP), filed on Jun. 09, 1999. | ||
| Int. Cl. H01L 23/12 (2006.01); H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 23/28 (2006.01); H01L 21/00 (2006.01) | ||
| U.S. Cl. 257—704 [257/675; 257/706; 257/707; 257/710; 257/717; 257/718; 257/719; 257/720; 257/722; 257/726; 257/727; 257/796; 438/122] | 4 Claims |
| 1. A sealing structure for multi-chip modules comprising:
a wiring board having one face mounted with a plurality of semiconductor devices and another face having connecting pins arranged
thereover;
a first frame having a thermal expansion coefficient compatible with that of the wiring board, the first frame provided on
a periphery of the face of the wiring board mounted with the semiconductor devices;
a second frame disposed over the first frame;
a cap having a circumference and having a thermal expansion coefficient different from that of the first and second frames
and covering the plurality of semiconductor devices;
a heat conducting material disposed between the cap and the plurality of semiconductor devices for transmitting heat from
the semiconductor devices to the cap;
an attachment to fix the first frame and the wiring board to each other;
a fastener for fastening the first and second frames and the cap together via an intervening member,
the cap being spaced apart from the first and second frames by the intervening member,
wherein there is an absence of any direct physical contact between the cap and either the first and second frames.
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