| US 7,517,769 B2 | ||
| Integrateable capacitors and microcoils and methods of making thereof | ||
| Koenraad Van Schuylenbergh, Sunnyvale, Calif. (US); Eugene M. Chow, Fremont, Calif. (US); and JengPing Lu, San Jose, Calif. (US) | ||
| Assigned to Palo Alto Research Center Incorporated, Palo Alto, Calif. (US) | ||
| Filed on Dec. 28, 2005, as Appl. No. 11/319,075. | ||
| Prior Publication US 2007/0148895 A1, Jun. 28, 2007 | ||
| Int. Cl. H01L 21/20 (2006.01) | ||
| U.S. Cl. 438—381 [257/532] | 20 Claims |
| 1. A method for integrally forming a capacitor and a microcoil on a semiconductor substrate, the method comprising:
depositing and patterning a dielectric layer on the substrate;
depositing and patterning a sacrificial layer on the substrate;
depositing and patterning conductive material on the semiconductor substrate, the patterned conductive material including
a windings portion of the microcoil, an overlapping electrode portion of the capacitor and a support portion for the electrode
portion of the capacitor;
depositing and patterning a polymer layer on the semiconductor substrate;
removing an exposed portion of the conductive material exposed by the patterned polymer layer to release a portion of the
conductive pattern from the semiconductor substrate to form out-of-plane windings of the microcoil;
depositing a second conductive material on exposed portions of the conductive material; and
removing the sacrificial layer.
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