| US 7,517,722 B2 | ||
| Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds | ||
| Bernd Goller, Otterfing (Germany); Robert-Christian Hagen, Sarching (Germany); Gerald Ofner, Bad Abbach (Germany); Christian Stuempfl, Schwandorf (Germany); Stefan Wein, Regensburg (Germany); and Holger Wörner, Regensburg (Germany) | ||
| Assigned to Infineon Technologies AG, Munich (Germany) | ||
| Filed on Jul. 24, 2006, as Appl. No. 11/491,746. | ||
| Application 11/491746 is a division of application No. 10/651856, filed on Aug. 29, 2003, abandoned. | ||
| Claims priority of application No. 102 40 460 (DE), filed on Aug. 29, 2002. | ||
| Prior Publication US 2006/0258046 A1, Nov. 16, 2006 | ||
| Int. Cl. H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01) | ||
| U.S. Cl. 438—108 [438/106; 438/112; 438/124] | 23 Claims |
| 1. A method of producing a blank having a plurality of component positions for electronic components, the method which comprises
the following method steps:
producing at least one of a carrier plate and a first plastic layer from a plastic compound being more highly crosslinked
in a lower region than in an upper region;
fitting a semiconductor chip in each of the component positions of the blank, and thereby forming a bead of plastic compound
of the first plastic layer, the bead surrounding marginal sides of the semiconductor chip;
applying a second plastic layer; and
curing the plastic layers for forming a self-supporting, dimensionally stable plastic plate with embedded semiconductor chips
in the component positions.
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