| US 7,517,562 B2 | ||
| Deposition method using a uniform electric field | ||
| Young Hun Paik, Kyoungsangbuk-do (Korea, Republic of) | ||
| Assigned to LG Display Co., Ltd., Seoul (Korea, Republic of) | ||
| Filed on Jun. 30, 2006, as Appl. No. 11/477,387. | ||
| Application 11/477387 is a continuation of application No. 10/144806, filed on May 15, 2002, granted, now 7,081,165, filed on Jul. 25, 2006. | ||
| Claims priority of application No. 10-2001-27128 (KR), filed on May 18, 2001. | ||
| Prior Publication US 2007/0014932 A1, Jan. 18, 2007 | ||
| Int. Cl. B05D 1/04 (2006.01) | ||
| U.S. Cl. 427—458 [427/533; 427/248.1] | 12 Claims |
| 1. A deposition method, comprising the steps of:
placing a substrate on a susceptor inside a chamber, the susceptor including a center pin passing through the susceptor for
lifting the substrate up and down;
applying a first voltage source to the susceptor;
electrically connecting a connection member extending along and attached to an entire axial length of the center pin to the
first voltage source;
applying a second voltage source to a counter electrode to generate a uniform electric field between the counter electrode
and the substrate; and
forming a film on the substrate by chemical vapor deposition.
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