US 7,517,553 B2
	Adhesive aid composition
Makoto Uchida, Tokyo (Japan); and Toyofumi Asano, Tokyo (Japan)
Assigned to Nippon Kayaku Kabushiki Kaisha, Tokyo (Japan)
Appl. No. 10/573,303 PCT Filed May 11, 2004, PCT No. PCT/JP2004/006259 § 371(c)(1), (2), (4) Date Apr. 26, 2006, PCT Pub. No. WO2005/030896, PCT Pub. Date Apr. 07, 2005.
Claims priority of application No. 2003-336243 (JP), filed on Sep. 26, 2003.
Prior Publication US 2007/0026227 A1, Feb. 01, 2007
Int. Cl. B05D 1/38 (2006.01)

U.S. Cl. 427—96.1  [427/96.2; 427/340; 427/412.1]

9 Claims

1. A process for producing a surface-adhesive film comprising applying a polyimide precursor solution to a substrate, drying the polyimide precursor solution to prepare a polyimide precursor film, applying an adhesive aid composition containing a phenolic hydroxyl group-containing polyamide and a solvent to the polyimide precursor film, drying the adhesive aid composition, and then imidizing the polyimide precursor by heating at 200° C. to 500° C.