| US 7,517,419 B2 | ||
| Substrate support jig, circuit board production apparatus, and method of producing circuit board | ||
| Tatsuki Nogiwa, Yawata (Japan); Mitsuhiro Ikeda, Kobe (Japan); Hiroshi Yamauchi, Katano (Japan); and Mineo Tokunaga, Kagoshima-ken (Japan) | ||
| Assigned to Panasonic Corporation, Osaka (Japan) | ||
| Filed on Apr. 16, 2004, as Appl. No. 10/825,335. | ||
| Prior Publication US 2005/0230050 A1, Oct. 20, 2005 | ||
| Int. Cl. B32B 37/20 (2006.01) | ||
| U.S. Cl. 156—152 [156/297; 156/299; 156/344; 269/21] | 26 Claims |
| 1. A substrate support jig for removably holding a substrate when mounting electronic components on the substrate, the substrate
support jig comprising:
a base member having a first surface and a second surface; and
an adhesive material being made of a material able to adhere to the substrate, the adhesive material being provided on the
first surface of the base member,
wherein a first region which is provided with the adhesive material and a second region which is not provided with the adhesive
material are provided on the first surface of the base member,
wherein the second region is enclosed by the first region, and
wherein the base member is provided with through holes penetrating through the second region from the first surface of the
base member to the second surface of the base member for removing the substrate from the base member.
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