a bump bonding device for forming bumps on members arranged in a grid pattern on a workpiece, the members including ICs;

a recognition device, including an image pickup camera movable in column and row directions above the workpiece to image detection marks on the workpiece, for detecting a position and an inclination of the members based upon image pickup information of said image pickup camera;

a control device configured to:

(i) define basic blocks from the members, each of the basic blocks having a plurality of the members adjacent one another in a row or column direction or in row and column directions,

(ii) control said recognition device so as to independently recognize positions of the basic blocks, and

(iii) control said bump bonding device, based upon positional recognition information obtained from independently recognizing the position of a respective one of the basic blocks, so as to continuously form bumps on the members defining the respective one of the basic blocks;

a wafer turning member onto which the semiconductor wafer is to be loaded, said wafer turning member being rotatable in a circumferential direction of the semiconductor wafer when loaded on said wafer turning member; and

a turning device for turning said wafer turning member in the circumferential direction via control of said control device;

wherein the control device is also configured to:

(i) control said recognition device so as to detect an inclination of the ICs on the semiconductor wafer, prior to controlling said recognition device so as to independently recognize positions of the basic blocks,

(ii) control said turning device on the basis of the detected inclination so as to turn said wafer turning member and thereby turn the semiconductor wafer loaded thereon such that the inclination is corrected, and

(iii) at a time of controlling said recognition device so as to independently recognize positions of the basic blocks, control said recognition device so as to detect an inclination of the ICs defining a respective one of the basic blocks by recognizing only one of the two marks; and

(iv) control said recognition device so as to independently recognize positions of the basic blocks by controlling said recognition device so as to independently recognize two marks from among plural marks applied to each IC defining the basic blocks.