| US 7,489,080 B2 | ||
| Direct current plasma panel (DC-PDP) and method of manufacturing the same | ||
| Gi-Young Kim, Suwon-si (Korea, Republic of); Hyoung-Bin Park, Suwon-si (Korea, Republic of); Sang-Hun Jang, Suwon-si (Korea, Republic of); Seung-Hyun Son, Suwon-si (Korea, Republic of); Sung-Soo Kim, Suwon-si (Korea, Republic of); and Ho-Nyeon Lee, Suwon-si (Korea, Republic of) | ||
| Assigned to Samsung SDI Co., Ltd., Suwon-si, Gyeonggi-do (Korea, Republic of) | ||
| Filed on Aug. 29, 2006, as Appl. No. 11/511,235. | ||
| Claims priority of application No. 10-2005-0079228 (KR), filed on Aug. 29, 2005. | ||
| Prior Publication US 2007/0046206 A1, Mar. 01, 2007 | ||
| Int. Cl. H05B 37/00 (2006.01); H01J 17/49 (2006.01); H05B 33/08 (2006.01) | ||
| U.S. Cl. 313—587 [313/581; 313/582; 313/583; 313/584; 313/585; 315/169.3; 445/24] | 21 Claims |
| 1. A direct current plasma display panel (DC-PDP), comprising:
a first substrate and a second substrate facing each other;
discharge cells between the first substrate and the second substrate;
first and second electrodes disposed in each of the discharge cells;
first conductive silicon layers contacting the first electrodes;
first oxidized porous silicon layers contacting the first conductive silicon layers;
second conductive silicon layers contacting the second electrodes;
second oxidized porous silicon layers contacting the second conductive silicon layers;
phosphor layers arranged in the discharge cells; and
a discharge gas disposed in the discharge cells.
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