| US 7,482,638 B2 | ||
| Package for a semiconductor light emitting device | ||
| Franklin J. Wall, Jr., Vacaville, Calif. (US) | ||
| Assigned to Philips Lumileds Lighting Company, LLC, San Jose, Calif. (US) | ||
| Filed on Aug. 29, 2003, as Appl. No. 10/652,348. | ||
| Prior Publication US 2005/0045901 A1, Mar. 03, 2005 | ||
| Int. Cl. H01L 29/22 (2006.01); H01L 31/12 (2006.01); H01L 27/15 (2006.01); H01L 29/26 (2006.01); H01L 23/52 (2006.01); H01L 21/00 (2006.01); H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 21/44 (2006.01) | ||
| U.S. Cl. 257—99 [257/81; 257/79; 257/782; 438/22; 438/121; 438/122] | 21 Claims |
| 1. A structure comprising:
a semiconductor light emitting device; and
a substrate comprising a ceramic core and at least one copper layer overlying the core, the at least one copper layer having
a thickness of at least 4 mils;
wherein the semiconductor light emitting device is electrically connected to the at least one copper layer and wherein the
substrate is configured to have a thermal conductivity of at least 24 W/m·K.
|