| US 7,475,175 B2 | ||
| Multi-processor module | ||
| David A. Klein, Carrollton, Tex. (US); Christian L. Belady, McKinney, Tex. (US); Shaun L. Harris, McKinney, Tex. (US); Michael C. Day, Allen, Tex. (US); Jeffrey P. Christenson, Plano, Tex. (US); Brent A. Boudreaux, Highland Village, Tex. (US); Stuart C. Haden, Allen, Tex. (US); Eric Peterson, McKinney, Tex. (US); Jeffrey N. Metcalf, Frisco, Tex. (US); James S. Wells, Windsor, Colo. (US); Gary W. Williams, Rowlett, Tex. (US); Paul A. Wirtzberger, Greenville, Tex. (US); Roy M. Zeighami, McKinney, Tex. (US); and Greg Huff, Plano, Tex. (US) | ||
| Assigned to Hewlett-Packard Development Company, L.P., Houston, Tex. (US) | ||
| Filed on Mar. 15, 2004, as Appl. No. 10/800,837. | ||
| Claims priority of provisional application 60/455605, filed on Mar. 17, 2003. | ||
| Prior Publication US 2004/0225821 A1, Nov. 11, 2004 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01L 23/34 (2006.01); H01L 23/12 (2006.01); H05K 7/20 (2006.01); G06F 13/00 (2006.01) | ||
| U.S. Cl. 710—100 [257/706; 257/711; 361/702; 361/707; 361/719] | 40 Claims |
| 26. A system comprising:
a plurality of processors mounted onto a processor board;
a power board;
a heat spreader disposed with the plurality of processors and the power board in a first module conforming to a standard single-processor
module footprint, wherein the power board is piggybacked with regard to the processor board, wherein the heat spreader is
piggybacked with regard to the power board, and wherein the heat spreader thermally contacts the power board and the processor
board;
a computer system; and
a system board adapted to communicate with the computer system and comprising an interface adapted to communicate with a standard
single-processor module, wherein the first module is coupled to the system board and is in communication with the system board
and the computer system.
|