| US 7,474,541 B2 | ||
| Printed circuit board and heat dissipating metal surface layout thereof | ||
| Tse-Hsine Laio, Xindian (Taiwan); and Ting-Kuo Kao, Xindian (Taiwan) | ||
| Assigned to Giga-Byte Technology Co., Ltd., Taipei (Taiwan) | ||
| Filed on May 12, 2006, as Appl. No. 11/383,185. | ||
| Prior Publication US 2007/0261882 A1, Nov. 15, 2007 | ||
| Int. Cl. H05K 7/12 (2006.01) | ||
| U.S. Cl. 361—808 | 14 Claims |
| 1. A printed circuit board, comprising:
a substrate;
a heat dissipating layer, disposed on a surface of the substrate with a first surface in contact with the surface of the substrate;
an adhering layer, including a plurality of solid adhering bars disposed alternately in a first direction and a second direction
and adhered onto a second surface of the heat dissipating layer opposite to the first surface to form a protruding surface
for each solid adhering bar; and
an insulating coating formed on the second surface of the heat dissipation layer to fill between the solid adhering bars.
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