| US 7,473,937 B2 | ||
| Side-emission type LED package | ||
| Young Sam Park, Seoul (Korea, Republic of); Hyung Suk Kim, Kyungki-do (Korea, Republic of); Jung Kyu Park, Seoul (Korea, Republic of); Ho Sik Ahn, Kyungki-do (Korea, Republic of); Young June Jeong, Kyungki-do (Korea, Republic of); Hun Joo Hahm, Kyungki-do (Korea, Republic of); and Bum Jin Kim, Kyungki-do (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon, Kyungki-Do (Korea, Republic of) | ||
| Filed on Dec. 28, 2005, as Appl. No. 11/318,837. | ||
| Claims priority of application No. 10-2005-0010046 (KR), filed on Feb. 03, 2005; and application No. 10-2005-0044649 (KR), filed on May 26, 2005. | ||
| Prior Publication US 2006/0171151 A1, Aug. 03, 2006 | ||
| Int. Cl. H01L 29/22 (2006.01) | ||
| U.S. Cl. 257—98 [257/E33.067] | 8 Claims |
| 1. An Light Emitting Diode (LED) assembly, comprising:
multiple LED chips;
multiple lower structures each lower structure sealing one of the multiple LED chips and configured to guide light upward
from the LED chip;
a single substrate supporting multiple said lower structures from below;
a single transparent plate arranged above the substrate, and spaced upwardly from multiple said lower structures; and
multiple upper structures arranged on the underside of the transparent plate and each upper structure spaced upwardly from
one of multiple said lower structures by an air layer to reflect light guided upward by the respective lower structure, radially
outwardly in lateral direction.
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