US 7,473,758 B2
Solvent cleaning system and method for removing contaminants from solvent used in resin recycling
George W. Bohnert, Harrisonville, Mo. (US); Thomas E. Hand, Lee's Summit, Mo. (US); and Gary M. DeLaurentiis, Jamestown, Calif. (US)
Assigned to Honeywell Federal Manufacturing & Technologies, LLC, Kansas City, Mo. (US)
Filed on Jun. 26, 2006, as Appl. No. 11/426,530.
Application 11/426530 is a continuation in part of application No. 11/096880, filed on Apr. 01, 2005, granted, now 7,253,253.
Prior Publication US 2006/0287213 A1, Dec. 21, 2006
This patent is subject to a terminal disclaimer.
Int. Cl. C08F 6/00 (2006.01); C08J 3/00 (2006.01)
U.S. Cl. 528—480  [422/122] 43 Claims
 
1. A system, comprising:
one or more solvent wash vessels to expose resin particles to a non-carbon dioxide based solvent, the solvent contacting the resin particles in the one or more solvent wash vessels to substantially remove contaminants on the resin particles;
a first particle removal element to remove the resin particles from the one or more solvent wash vessels;
a separator to separate the solvent from the resin particles after removal from the one or more solvent wash vessels;
a second particle removal element to remove the resin particles from the separator;
a solvent removing element to expose the resin particles to a solvent removing agent after removal from the separator to substantially remove any residual solvent remaining on the resin particles after separation, wherein the solvent removing agent contains carbon dioxide; and
a solvent cleaning system to substantially remove the contaminants from the solvent after contacting the resin particles so that the solvent can be reused in the one or more solvent wash vessels, the solvent cleaning system in fluid communication with the one or more solvent wash vessels so that the solvent can be removed from the one or more vessels.