| US 7,473,578 B2 | ||
| Encapsulation for particle entrapment | ||
| Edward C. Fisher, Lucas, Tex. (US); and Lawrence T. Latham, Plano, Tex. (US) | ||
| Assigned to Texas Instruments Incorporated, Dallas, Tex. (US) | ||
| Filed on Jun. 11, 2007, as Appl. No. 11/761,111. | ||
| Application 11/761111 is a division of application No. 10/955083, filed on Sep. 30, 2004, granted, now 7,230,325. | ||
| Application 10/955083 is a division of application No. 09/705466, filed on Nov. 03, 2000, granted, now 6,841,412. | ||
| Claims priority of provisional application 60/163862, filed on Nov. 05, 1999. | ||
| Prior Publication US 2007/0254403 A1, Nov. 01, 2007 | ||
| Int. Cl. H01L 21/44 (2006.01) | ||
| U.S. Cl. 438—106 [438/48; 438/54; 438/55; 438/64] | 9 Claims |
| 1. A method of protecting debris-intolerant micromechanical devices, said method comprising:
providing a device having at least one debris-generating region, and at least one debris-intolerant region;
encapsulating at least one of said debris-generating regions and at least a portion of at least one of said debris-intolerant
regions with a blocking material;
removing said blocking material from said at least one of said debris-intolerant regions; and
attaching a package lid to said package substrate, to enclose said device and said blocking material.
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