US 7,473,457 B2
Wood flooring composed of WPL, base and soundproof layer
Kie-Sun Han, Cheongju-si (Korea, Republic of); Byeong-Hoe Kim, Ulsan (Korea, Republic of); Il-Hong Min, Cheongju-si (Korea, Republic of); and Byeong-Roh Jeong, Cheongju-si (Korea, Republic of)
Assigned to LG Chem, Ltd., (Korea, Republic of)
Appl. No. 10/546,853
PCT Filed Sep. 30, 2003, PCT No. PCT/KR03/01996
§ 371(c)(1), (2), (4) Date Aug. 24, 2005,
PCT Pub. No. WO2004/098881, PCT Pub. Date Nov. 18, 2004.
Claims priority of application No. 20-2003-0013966 U (KR), filed on May 06, 2003; and application No. 20-2003-0017703 U (KR), filed on Jun. 05, 2003.
Prior Publication US 2006/0172118 A1, Aug. 03, 2006
This patent is subject to a terminal disclaimer.
Int. Cl. B32B 21/06 (2006.01); B32B 21/14 (2006.01); B32B 29/00 (2006.01); E04F 13/10 (2006.01); E04F 13/077 (2006.01); E04F 15/16 (2006.01); E04F 15/18 (2006.01)
U.S. Cl. 428—167  [428/172; 428/535; 428/537.1; 428/537.5; 52/390; 52/403.1] 7 Claims
OG exemplary drawing
 
1. A laminate wood flooring for an under-floor heating system comprising a wood veneer of high pressure resin impregnation laminate (WPL), an adhesive layer and a base,
wherein the WPL includes a base-reinforcing layer impregnated in a phenol resin, a resin-impregnated or not impregnated natural veneer layer, a resin-impregnated overlay layer including an overlay paper impregnated in an amino resin selected from urea, urea-melamine or melamine resins, and a urethane primer-treated UV coating layer layered in this order from the bottom, the base-reinforcing layer being made of at least one material selected from a high-density fiberboard, a kraft paper or a shielding paper,
the base is back-grooved, and is selected from a polyvinyl chloride resin layer, an oriented strand board (OSB), a high-density fiberboard (HDF) or a waterproof plywood, and
the WPL and the base are adhered to each other by the adhesive layer.